| Project | Processing capacity | Detailed process |
|---|---|---|
| Number of layers | 1-6 layers | The number of layers refers to the number of layers in the design file, and FABmyPCB.com can produce 1-6 layers of through-hole plates. |
| Sheet type | FR-4 | We only accepts FR-4 sheet (built-in KB6160A TG130/KB6165F TG150 and Guoji A-class TG130) |
| biggest size | 400mm*600mm | Ultra-long board of 600mm or more, the width cannot be more than 300mm |
| Dimensional accuracy | ±0.2mm | CNC outline tolerance ± 0.2mm, V-cut board shape tolerance ± 0.5mm |
| Plate thickness range | 0.4–2.4mm | Jeddah currently produces plate thickness: 0.4/0.6/0.8/1.0/1.2/1.6/2.0/2.4mm |
| Plate thickness tolerance (t≥1.0mm) | ± 10% | Please note that due to the production process (sinking, solder masking, pad plating will increase the thickness of the board) |
| Plate thickness tolerance (t<1.0mm) | ±0.1mm | Please note that due to the production process (sinking, solder masking, pad plating will increase the thickness of the board) |
| Minimum line width | 4mil (0.1mm) | Currently available 4mil line width, line width is as large as 6mil, and the price less than 6mil will be slightly more expensive. |
| Minimum clearance | 4mil (0.1mm) | Currently 4mil line spacing can be connected, the gap is as much as 6mil, and the price less than 6mil will be slightly more expensive. |
| Finished outer layer copper thickness | 35um/70um/105u
m(1OZ/2OZ/3OZ) |
Refers to the thickness of the outer circuit copper foil of the finished circuit board, 1 OZ=35um, 2 OZ=70um, 3OZ=105um |
| Finished inner layer copper thickness | 35um/50um | The 1.6 and 2.0 plate thickness of the four or six-layer board can be specified according to customer requirements. |
| Drilling aperture (machine drill) | 0.2–6.3mm | 0.2mm is the minimum hole diameter of the hole, 6.3mm is the maximum hole diameter of the hole. If it is larger than 6.3mm, the factory should handle it separately; 0.65mm is the minimum hole knife (PTH) hole diameter. If there is a metal groove project less than 0.65mm, increase it to 0.65mm production, please know! The minimum hole of the aluminum substrate is 0.8mm, the minimum hole of the aluminum substrate slot is 1.2mm; the minimum hole diameter of the copper-free hole (NPTH) is 0.45mm, if it is less than the diameter is 0.45mm, it is known! |
| Through hole single side welding ring | ≥0.153mm (6mil) | If the conductive hole or the plug hole is too small, but there is enough space there, it does not limit the size of the single side of the solder ring; if there is not enough space and dense lines, the smallest one side Welding ring must not be less than 0.153mm |
| Finished hole diameter (machine drill) | 0.2–6.20mm | Due to the metal copper attached to the inner wall of the hole, the hole diameter of the finished hole is generally smaller than the hole diameter in the document. |
| Aperture tolerance (machine drill) | ±0.08mm | The tolerance of the drilling hole is ±0.08mm, for example, the hole designed to be 0.6mm, and the finished hole diameter of the physical plate is 0.52–0.68mm. |
| Solder mask type | Photosensitive ink | Photosensitive ink is the most used type now, and thermosetting oil is generally used in low-grade single-sided cardboard. |
| Minimum character width | ≥0.15mm | The minimum width of the character, if less than 0.15mm, the physical board may cause characters to be unclear due to design reasons. |
| Minimum character height | ≥0.8mm | The minimum height of the character, if less than 0.8mm, the physical board may cause characters to be unclear due to design reasons. |
| Character aspect ratio | 1:5 | The most suitable aspect ratio is more conducive to production |
| Trace and shape spacing | ≥0.3mm (12mil) | When the slab is shipped, the distance between the line layer and the board outline line is not less than 0.3mm; the V-cut board is shipped, and the distance from the line to the V-cut center line cannot be less than 0.4mm. |
| Imposition: gapless imposition gap | 0 gap fight | Is imposition shipment, the gap between the middle board and the board is 0 (document has detailed explanation) |
| Imposition: gap gap | 1.6mm | The gap with gap imposition should not be less than 1.6mm, otherwise it is difficult to rub the edge |
| Pads manufacturers copper way | Hatch way copper | Manufacturers use reduced copper, this customer with pad design must pay attention to |
| Pads in the Pads software | Drill Drawing layer | If there are more non-metallization slots on the board, please draw on the Drill Drawing layer. |
| Window opening in Protel/dxp software | Solder layer | A few engineers misplaced the paste layer, and Jeddah did not handle the paste layer. |
| Protel/dxp form factor | Use the Keepout layer or the mechanical layer | Please note: a file can only exist in one shape layer. Never allow two shape layers to exist at the same time. Please delete the unused shape layer, that is, you can only select one of the Keepout layer or the mechanical layer when drawing the shape. |
| Half hole process minimum half hole aperture | 0.6mm | The semi-hole process is a special process with a minimum hole diameter of not less than 0.6mm. |
| Solder mask | 0.1mm | Jeddah is currently not doing solder masks |
| Protel/dxp file | Gerberfile | Processing is based on the exported gerber file, know! |
